لاب توب الألعاب من ديل 15-ALNWV-CTO-WHT - Core M15-i9 2.4 2.4 جيجاهرتز ذاكرة رام 32 جيجابايت وسعة تخزين 1 تيرابايت 8 جيجابايت ويندوز 10 مقاس شاشة 15.6 بوصة عالية الوضوح أبيض لوحة مفاتيح إنجليزي

The new Alienware m15 is lean and powerful. Designed from the ground up, the m15 features premium magnesium alloy materials that deliver weight savings while reducing thickness and delivering a stiffer, sturdy, chassis - all within a sleek aesthetic.

Vapor Chamber Technology

Alienware’s new Vapor Chamber Technology uses advanced methods to efficiently dissipate heat. The new Alienware m15 is engineered with a dedicated vapor chamber in between the CPU and copper heat pipes. It's all designed to manage the thermal flow and maximize performance. These chambers utilize the phase-changing nature of liquid to transfer heat more effectively than a solid piece of metal or copper heat pipes. Vapor Chambers are also more versatile than copper heat pipes in that they can be designed to be spread evenly across an entire chip that needs to be cooled.

Dual-intake, dual-exhaust airflow design

Our thin and light chassis prioritizes performance with a dual fan design that pulls in cool air from the top and bottom vents, and exhales exhaust out the rear and side vents for optimal cooling of the core components.

High voltage driving fan

The fire resistant, Kevlar-like liquid-crystal polymer fan blades include sleeve bearings, and 3-phase fan control to create less friction and circulate air more efficiently. There are now 132 unique fan blades to cool both the CPU and GPU.

Load-balancing heat pipes

The dynamics of thermal activity across critical components like the GPU and the CPU are intelligently discharged across four 3.5mm diameter copper-composite heat pipes.

Dense copper fin stacks

The new m15 has the greatest amount of copper material, by weight, dedicated to providing heat dissipation to core components than on any previous m15. The new m15 has also increased the size of its heat pipes by 40% to increase overall surface area and heat dissipation.